# Design Rule Verification Report

Date: |  | 23.07.2018
Time: |  | 09:35:15
Elapsed Time: |  | 00:00:00
Filename: |  | C:\Users\a.unterreitmeier\Documents\Projekte\WPC_Demokit_200W_MCU\WE_WPC_002_V03_2018\Altium-Files\WE-WPC-002-V03-2018.PcbDoc
Warnings: |  | 4
Rule Violations: |  | 0

## Summary

Warnings | Count
--- | ---
Unplated multi-layer pad(s) detected | 4
Total | 4

Rule Violations | Count
--- | ---
Clearance Constraint (Gap=0.2mm) (All),(All) | 0
Short-Circuit Constraint (Allowed=No) (All),(All) | 0
Un-Routed Net Constraint ( (All) ) | 0
Width Constraint (Min=0.2mm) (Max=5mm) (Preferred=0.3mm) (All) | 0
Power Plane Connect Rule(Relief Connect )(Expansion=0.508mm) (Conductor Width=0.254mm) (Air Gap=0.254mm) (Entries=4) (All) | 0
Hole Size Constraint (Min=0.025mm) (Max=5mm) (All) | 0
Total | 0

## Warnings

Unplated multi-layer pad(s) detected
Pad BO3-1(76mm,5mm) on Multi-Layer on Net NetBO1_1
Pad BO4-1(5mm,75mm) on Multi-Layer on Net NetBO1_1
Pad BO1-1(5mm,5mm) on Multi-Layer on Net NetBO1_1
Pad BO2-1(76mm,63mm) on Multi-Layer on Net NetBO1_1

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